| 摘要 |
The present invention provides an electronic parts packaging structure (1) that includes a mounted body on which an electronic parts (20) is mounted, the electronic parts (20) having a connection pad (18), which has an etching stopper film (16) (a copper film, a gold film, a silver film, or a conductive paste film) as an uppermost film, and mounted on the mounted body to direct the connection pad (18) upward, an interlayer insulating film (28a) for covering the electronic parts (20), a via hole (28y) formed in the insulating film (28a) on the connection pad (18) of the electronic parts (20), and a wiring pattern (26b) connected to the connection pad (18) via the via hole (28y). |
