发明名称
摘要 A print mask is used to form bumps on barrier metal layers of a wafer. The mask comprises a plurality of elongated perforations disposed in a linear arrangement such that paste can be applied to an object to be printed on via the perforations. Each of the perforations includes an edge disposed along the longitudinal direction, and the edge is inclined with respect to the direction perpendicular to the direction of arranging the perforations.
申请公布号 JP4210171(B2) 申请公布日期 2009.01.14
申请号 JP20030204168 申请日期 2003.07.30
申请人 发明人
分类号 H01L21/60;H01L23/485 主分类号 H01L21/60
代理机构 代理人
主权项
地址