发明名称 MODULE HAVING A LEAD FRAME EQUIPPED WITH COMPONENTS ON BOTH SIDES
摘要 <p>A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).</p>
申请公布号 EP1327226(B1) 申请公布日期 2009.01.14
申请号 EP20010982364 申请日期 2001.09.26
申请人 NXP B.V. 发明人 AFLENZER, GUNTER;SCHOBER, JOACHIM, H.;TOTH, MARCUS
分类号 G06K19/077;H01L25/00;H01L23/50;H04B1/59 主分类号 G06K19/077
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