发明名称 Biochips
摘要 A package comprising a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet. Also claimed are kits and packaging methods.
申请公布号 GB2450992(A) 申请公布日期 2009.01.14
申请号 GB20080012617 申请日期 2008.07.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNE-YOUNG LEE;DONG-HO LEE
分类号 C40B60/12 主分类号 C40B60/12
代理机构 代理人
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