Bond pad structure for copper metallization having increased realiability and method for fabricating same,申请号GB20060025713-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Bond pad structure for copper metallization having increased realiability and method for fabricating same
摘要
申请公布号	GB2430802(B)	申请公布日期	2009.01.14
申请号	GB20060025713	申请日期	2005.04.29
申请人	SPANSION LLC	发明人	INKUK KANG;HIROYUKI KINOSHITA;BOON-YONG ANG;SIMON CHAN;CINTI XIAOHUA CHEN
分类号	H01L23/485	主分类号	H01L23/485
代理机构		代理人
主权项
地址

您可能感兴趣的专利

STRESS LIMITER FOR NON-METALLIC CABLE SUPPORT FITTINGS

PROCESS FOR TREATING POWDERS

Exhaust return system for burner with fan - has pneumatic proportion regulator comparing air and exhaust gas pressures

Ornamental wrist-watch usable for game of chance - has three decorative elements movable w.r.t. hands revolving above annulus engraved in image of roulette wheel

CONFEZIONE CON MEZZI ANTICONTRAFFAZIONE ED INDICAZIONE.

METHOD AND DEVICE FOR DETERMINING PHYSICAL STATE PARAMETERS OF A MEDIUM

HEAT RECOVERABLE ARTICLES

Non-adhesive biocompatible surface.

Bitumen emulsion and its use.

FABRIC MADE FROM BLENDED YARN COMPRISING AROMATIC POLYAMIDE FIBER AND POLYESTER FIBER.

Apparatus for cutting, slitting, perforating or scoring sheets and method for producing the same.

Rotary printing machine.

Method and apparatus for fast determination of weights.

Arc discharge coating apparatus with auxiliary ionization anode.

Iso-olefin production and etherification process.

Tools for machining materials.

Backlighting device.

MAGNETIC RECORDING MEDIUM.