Method for singulation of wafers

摘要

A method for singulating wafers is disclosed. The method comprises the steps of: introducing trenches (13) between dies (15) to be separated in the active side (11) of a thick wafer (1); applying a singulation tape (7) on the active side (11) of the wafer (1), wherein the singulation tape (7) is unsupported from the side facing away from the wafer (1) and separating the dies (15) by etching the wafer (1) on the unsupported singulation tape (7) from the backside (12) of the wafer (1).