| 摘要 |
A DCB for an intelligent power module and a method for forming an intelligent power module thereof are provided to improve the yield of the intelligent power module by forming a power supply circuit pattern portion and a power control circuit pattern portion on the upper side of an upper metal film at the same time. A DCB substrate comprises an insulator substrate, an upper metal film and a bottom metal film. The upper metal film is adhered by the thickness of 140(micro meter)~160(micro meter) in the upper side of the insulator substrate. The bottom metal film is adhered by the thickness of 140(micro meter)~160(micro meter) in the lower surface of the insulator substrate. The insulator substrate is made of the ceramics of BeO and Al2O3 A1N. The upper metal film and bottom metal film are made of copper or copper alloy. One or more power supply circuit parts(308a) and electric power control circuit parts(310a) are formed in the upper side of the upper metal film at the same time.
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