| 摘要 |
A circuit connection structure and a printed circuit board is provided to miniaturize a printed circuit board and a semiconductor package by suppressing impedance mismatching without increasing the wiring band of a printed circuit board. A printed circuit board(100) comprises a GND layer(102), an insulating layer and a signal wiring layer. The signal wiring layer interposes the insulating layer and is adjacent to the GND layer. The signal wiring layer connects the first area and the second part of the printed circuit board. Two batch of differential signal wires(104,105) are parallely arranged in the signal wiring layer. Between the two batch of differential signal wires, the width of two wires(104a,104b) consisting of a batch of differential signal wires decreases from the first part to the second part with the same ratio. Interval between 2 wirings is fixed. Between the two batch of differential signal wires, one batch of differential signal wires is adjacent to the other batch of differential signal wires. The width of two wires(105a,105b) consisting of the other batch of differential signal wires increases from the first part to the second part with the same ratio. A first slit(104s) and a second slit(105s) are formed in the GND layer.
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