| 摘要 |
A urethane resin is provided to form a flexible film having excellent adhesion, folding endurance, low flexibility, soldering resistance, electroless gold plating resistance and electric insulation. A urethane resin has a phenolic hydroxyl group or a carboxyl group and a phenolic hydroxyl group. The urethane resin is obtained by reacting (a) polyisocyanate, (b) a compound having at least two alcoholic hydroxyl group and (c) a compound having one alcoholic hydroxyl group and at least one phenolic hydroxyl group in one molecule. The thermosetting resin composition additionally contains (A) the urethane resin, (B) a thermosetting compound and (C) a curing accelerator. The thermoplastic compound (B) is the epoxy resin.
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