发明名称 |
Power semiconductor module with contact springs |
摘要 |
The power semiconductor module has a housing (3), a substrate with a metallic conducting path, and a connecting element guided outward from a conducting path or a contact surface of power semiconductor element arranged on a conducting path. A contact unit of a contact spring (70) is formed as pin and a diameter (D) of a partial recess (34) is smaller than the sum of the diameter of the pin-shaped contact unit and the displacement determined by a deformation (720) of the contact unit. The deformation is arranged between another partial recess and the substrate. |
申请公布号 |
EP1933379(A3) |
申请公布日期 |
2009.01.14 |
申请号 |
EP20070024104 |
申请日期 |
2007.12.12 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
POPP, RAINER;MANZ, YVONNE |
分类号 |
H01L25/07;H01L23/48 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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