| 摘要 |
A microelectronic contact structure for uniting a probe and a multilayer circuit board is provided to bond probe at a multilayer circuit board by forming a groove of fixed depth on the multilayer circuit board. A groove(403) of fixed depth is built up in a multilayer circuit board(401). A probe(405) is combined in the multilayer circuit board by direct bonding. The probe moves top and bottom through the groove. A passive device of probe cards is arranged in the groove of the multilayer circuit board. A process for forming a pillar of fixed height on the multilayer circuit board is removed by forming the groove on the multilayer circuit board. |
