发明名称 |
Stack semiconductor package formed by multiple molding and method of manufacturing the same |
摘要 |
Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages and a method of manufacturing the same. The stacked semiconductor packages are combined together through sealing resins by molding them multiple times, resulting in uniform stress distribution across substantially the entire interface between the semiconductor packages.
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申请公布号 |
US7476962(B2) |
申请公布日期 |
2009.01.13 |
申请号 |
US20060369443 |
申请日期 |
2006.03.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HYUN-KI |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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