发明名称 Dual sided board thermal management system
摘要 A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a printed circuit board, and a plurality of coolant dispensing units within the housing directed towards opposite sides of the printed circuit board to thermally manage electronic components on opposite sides of the printed circuit board.
申请公布号 US7477513(B1) 申请公布日期 2009.01.13
申请号 US20060618566 申请日期 2006.12.29
申请人 ISOTHERMAL SYSTEMS RESEARCH, INC. 发明人 CADER TAHIR;KNIGHT PAUL A.
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
代理机构 代理人
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