发明名称 |
Dual sided board thermal management system |
摘要 |
A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a printed circuit board, and a plurality of coolant dispensing units within the housing directed towards opposite sides of the printed circuit board to thermally manage electronic components on opposite sides of the printed circuit board.
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申请公布号 |
US7477513(B1) |
申请公布日期 |
2009.01.13 |
申请号 |
US20060618566 |
申请日期 |
2006.12.29 |
申请人 |
ISOTHERMAL SYSTEMS RESEARCH, INC. |
发明人 |
CADER TAHIR;KNIGHT PAUL A. |
分类号 |
H05K7/20;H01L23/36 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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