| 摘要 |
<p>A high power LED package and a fabrication method thereof are provided to improve the heat radiation by insulating a gap between a lead part and a main body part as an insulation part. A high power LED package comprises a main body(120), a lead part(130), and an insulation part(140). A lead arrangement part is formed on the upper surface passing through the main body, and an LED chip(110) is mounted on the upper surface. The lead part is disposed on the lead arrangement part, and exposed one end is connected with the LED electrically. The insulation part obstructs the electrical connection between the main body and the lead part by using an insulating material which is filled into the lead arrangement part.</p> |
