| 摘要 |
<p>A light emitting device is provided to improve the heat emission efficiency by rapidly transmitting the heat of the lead frame to the radiation pad on the lead frame and radiation pad with a heat transfer pad. In a light emitting device, a first lead frame(21) and the second lead frame(22) are formed on the substrate(10). The light emitting diode(30) is electrically connected to the first lead frame and the second lead frame, and it is located on surface the first lead frame. The radiation pad(60) is formed on substrate, and it electrically separates from the first lead frame. The heat transfer pad(70) is contacted with the first lead frame and radiation pad. Therefore, the first lead frame and radiation pad are thermally connected with the heat transfer pad. The first lead frame is directly contacted with the light emitting diode.</p> |
