| 摘要 |
( 1 ) An epoxy resin composition comprising an epoxy resin of the tetramethylbisphenol F type, a curing agent, a filler and a silane coupling agent comprising an aminosilane coupling agent having primary amino group; ( 2 ) an epoxy resin composition comprising an epoxy resin of the tetramethylbisphenol F type, a curing agent comprising a specific phenol compound and a filler; and ( 3 ) an epoxy resin composition comprising an epoxy resin of the tetramethylbisphenol F type, a curing agent and a specific filler, are provided. The epoxy resin compositions exhibit excellent reliability such as the reliability on resistance to peeling off and to swelling during the reflow and an excellent filling property during molding and can be advantageously used for sealing electronic circuit members. |
