| 摘要 |
Embodiments of the present invention provide a mounting assembly for mounting an electronic device to a surface. The mounting assembly generally includes a base including a mounting ball and a socket assembly operable to frictionally engage the ball to removably couple the socket assembly to the base. The base may be removably coupled with the surface and the socket assembly may be removably coupled with the electronic device. Such a configuration enables the electronic device to be easily positioned in confined environments by first attaching the base to the surface, then attaching the socket assembly to the base and positioning the socket assembly in a desired orientation, and finally attaching the electronic device to the socket assembly.
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