发明名称 |
Method for forming filling paste structure of WL package |
摘要 |
A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
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申请公布号 |
US7476565(B2) |
申请公布日期 |
2009.01.13 |
申请号 |
US20070799923 |
申请日期 |
2007.05.03 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;SUN WEN-BIN;YUAN HSI-YING;YU CHUN HUI |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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