| 摘要 |
<p>The device of manufacturing the semiconductor device is provided to increase the efficiency of the lithographic process by providing the bake oven system of the press type to the apparatus for forming the high refractive material on the semiconductor substrate. The plate(300) of the indirect heating method for the wafer(330) is equipped. The bake oven cover(340) covering the heating plate is equipped. The gas connection pipe(360) is equipped on the top of cover. The gas blowing nozzle(350) system is equipped in the inner side of the upper part. The first and second booster pumps(390, 380) are equipped to increase pressure by using the gas. The temperature controllers(360a, 360b 360c) are equipped to increase or cool the temperature of the gas between the booster pumps.</p> |
