| 摘要 |
A method for curing a deposited layer of a substrate is provided to reduce the consumption of energy compared to a method of curing printed electronics by using a large convection oven, and a system for curing a deposited layer of a substrate used in the method is provided. A curing system(20) comprises a support, a curing device(28), and a control system(32). The support has a plane surface(22) for supporting a substrate(24) on which material is deposited. The curing device includes a laser(40) emitting a light beam(46) to a portion or an entire portion of a layer of the material deposited on the substrate. The control system is electrical communication-connected with the curing device. |
