发明名称 |
CONDUCTOR FOIL WITH ADHESIVE LAYER, CONDUCTOR-CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD |
摘要 |
<p>Disclosed is a conductor foil with adhesive layer which enables to produce a printed wiring board having excellent heat resistance wherein transmission loss especially in high frequency band can be reduced and interlayer separation can be sufficiently suppressed. Also disclosed is a conductor-clad laminate. Specifically disclosed is a conductor foil with adhesive layer comprising a conductor foil and an adhesive layer formed on the conductor foil.The adhesive layer is composed of a curable resin composition containing a polyfunctional epoxy resin as a component (A), a polyfunctional phenol resin as a component (B), and a polyamideimide as a component (C). Also specifically disclosed is a conductor-clad laminate comprising an insulating layer, a conductor layer arranged opposite to the insulating layer, and an adhesive layer interposed between the insulating layer and the conductor layer. The adhesive layer is composed of a cured product of the resin composition containing the components (A), (B) and (C).</p> |
申请公布号 |
KR20090005070(A) |
申请公布日期 |
2009.01.12 |
申请号 |
KR20087026205 |
申请日期 |
2007.04.24 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
FUJIMOTO DAISUKE;MIZUNO YASUYUKI;DANJOBARA KAZUTOSHI;MASUDA KATSUYUKI;MURAI HIKARI |
分类号 |
B32B15/088;C09J163/00;H05K3/46 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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