| 摘要 |
A semiconductor memory device is provided to reduce time and the necessary cost by preventing the malfunction of a compression test result due to the fault of data input output pad. In a semiconductor memory device, compression part(220A, 220B, 220C, 220D) compress data consisting of a plurality of bits stored in a plurality of the bank(200A, 200B, 200C, 200D). The output select part selects expected data input output pad of a plurality of data input output pads in response to data input output pad change test signal(DQ TEST EN). The output select part outputs the output data of the compression part through the selected data input output pad. |
