| 摘要 |
A zebra connector manufacturing method is provided to supply superior electric conduction by forming pitch spacing narrowly even if the thickness of the copper thin layer becomes thick. A photosensitive film is coated onto the upper side and lower surface of the copper foil(S1). A mask pattern in which the fixed pitch spacing is formed is located in the upper side and the lower surface in which the photosensitive film is coated onto, and the ultraviolet ray is irradiated(S2). A photosensitive film coated onto the upper side and lower surface of the copper foil which is not exposed to the ultraviolet ray and is not hardened are removed through developer. A conductive layer having a circuit pattern is formed by etching a copper film part using an etchant(S4). The oxidation blocking and electric conductance of the conductive layer are improved by forming a plating layer on the conductive layer forming a circuit pattern(S6). A silicon is adhered to the upper side and lower surface of the conductive layer forming the circuit pattern(S7). A plurality of conductive layers is adhered to the upper side and lower surface in order to not placing on the in-line to upward and downward(S8).
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