LIGHT EMITTING DIODE PACKAGE HAVING COMPOSITE MATERIAL LAYER INCORPORATING CARBON NANO MATERIAL

摘要

The light-emitting diode package is provided to improve the heat dissipation through the lead which is connected to the multiple material layer containing the carbon nanomaterial. The light-emitting diode package comprises the chip mount area(21), and the light emitting diode chip(25) and the first composite material layer (22a). The chip mount area comprises the first and second leads(21a,21b) having the mounting surface for setting up the light emitting diode chip. The first and the second lead have one end part and the other end part on the mounting surface. One end part and the other end part are electrically connected. The light emitting diode chip is mounted on the mounting surface of the chip mount area. The first composite material layer is connected to the other end part of the first lead and contains the carbon nanomaterial.