ELECTRONIC COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT WITH SOLDER BUMP, SOLDER RESIN MIXED MATERIAL, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MANUFACTURING METHOD

摘要

In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecting section, and the solder connecting section contains a solder and an insulating filler. Alternatively, a solder bump is formed on the electrode of the electronic component and the solder bump includes the insulating filler.