发明名称 |
Method to improve time dependent dielectric breakdown |
摘要 |
In the back end of an integrated circuit employing dual-damascene interconnects, the interconnect members have a first non-conformal liner that has a thicker portion at the top of the trench level of the interconnect; and a conformal second liner that combines with the first liner to block diffusion of the metal fill material.
|
申请公布号 |
US7473636(B2) |
申请公布日期 |
2009.01.06 |
申请号 |
US20060306825 |
申请日期 |
2006.01.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANDA KAUSHIK;DEMAREST JAMES J.;FILIPPI RONALD G.;IGGULDEN ROY C.;KIEWRA EDWARD W.;MCGAHAY VINCENT J.;WANG PING-CHUAN;WANG YUN-YU |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|