发明名称 Process for ultra-thin body SOI devices that incorporate EPI silicon tips and article made thereby
摘要 The invention relates to a transistor that includes an ultra-thin body epitaxial layer that forms an embedded junction with a channel that has a length dictated by an undercut under the gate stack for the transistor. The invention also relates to a process of forming the transistor and to a system that incorporates the transistor.
申请公布号 US7473947(B2) 申请公布日期 2009.01.06
申请号 US20020194506 申请日期 2002.07.12
申请人 INTEL CORPORATION 发明人 MURTHY ANAND;DOYLE BRIAN;KAVALIEROS JACK;CHAU ROBERT
分类号 H01L21/00;H01L21/336;H01L29/417;H01L29/786 主分类号 H01L21/00
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