发明名称 Cooling device capable of reducing thickness of electronic apparatus
摘要 A printed circuit board unit with a cooling device includes a printed circuit board; a ventilation fan including blades rotating around a rotation axis intersecting the printed circuit board; a housing wall standing from a surface of the printed circuit board at a periphery of the ventilation fan; an inlet defined in the printed circuit board inside the housing wall and located under the blades of the ventilation fan; and an outlet defined in the housing wall to open in parallel with the surface of the printed circuit board. An electronic apparatus is also provided which further includes an electronic component mounted on the printed circuit board.
申请公布号 US7474533(B2) 申请公布日期 2009.01.06
申请号 US20070905895 申请日期 2007.10.05
申请人 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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