| 发明名称 |
Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement |
| 摘要 |
A chip carrier element (1) with a chip mounting surface (2) comprises a recessed region (3) adjacent to the surface to receive the chip fixing unit. An independent claim is also included for a component housing with a chip carrier element as above. |
| 申请公布号 |
DE10319782(B4) |
申请公布日期 |
2009.01.02 |
| 申请号 |
DE2003119782 |
申请日期 |
2003.04.30 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
WINTER, MATTHIAS;GRUBER, STEFAN;SCHMID, JOSEF;BOGNER, GEORG |
| 分类号 |
H01L23/13;H01L23/04;H01L23/495;H01L23/498;H01L33/62;H01S5/022 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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