发明名称 |
Integrierte Halbleiterschaltungsbaueinheit, Herstellungsverfahren dafür und Montageverfahren dafür |
摘要 |
A semiconductor integrated circuit device includes a semiconductor substrate having a first surface and including electrodes on the first surface of the semiconductor substrate; a glass coating film covering the first surface of the semiconductor substrate except the electrodes; an external electrode on the electrode in electrical contact with the electrode and having a polished external surface; and a cured resin layer on the glass coating film forming a barrier against intrusion of moisture and ions into the semiconductor substrate, and having the same area as the semiconductor substrate, and a polished external surface. |
申请公布号 |
DE4338432(B4) |
申请公布日期 |
2009.01.02 |
申请号 |
DE19934338432 |
申请日期 |
1993.11.10 |
申请人 |
MITSUBISHI DENKI K.K. |
发明人 |
SHINOMIYA, KOHJI |
分类号 |
H01L21/304;H01L23/50;H01L21/301;H01L21/56;H01L21/58;H01L21/60;H01L21/66;H01L23/31;H01L23/36;H01L25/065 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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