发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
The present invention provides a semiconductor device realizing reduced occurrence of a defect such as a crack at the time of adhering elements to each other. The semiconductor device includes a first element and a second element adhered to each other. At least one of the first and second elements has a pressure relaxation layer on the side facing the other of the first and second elements, and the pressure relaxation layer includes a semiconductor part having a projection/recess part including a projection projected toward the other element, and a resin part filled in a recess in the projection/recess part.
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申请公布号 |
US2009001386(A1) |
申请公布日期 |
2009.01.01 |
申请号 |
US20080081354 |
申请日期 |
2008.04.15 |
申请人 |
SONY CORPORATION |
发明人 |
KODA RINTARO;ARAKIDA TAKAHIRO;MASUI YUJI;OKI TOMOYUKI |
分类号 |
H01L21/00;H01S5/026;H01S5/183;H01S5/187 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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