发明名称 COMPOSITES WITH INTEGRATED MULTI-FUNCTIONAL CIRCUITS
摘要 An exemplary embodiment provides a composite substrate including a resin matrix that has embedded therein a flex circuit and reinforcing filler. The flex circuit includes a metallic circuit on a film that is co-cured with the resin matrix. The metallic circuit may be configured for any of a variety of functions, including for example, dissipating energy generated by a lightning strike on the composite substrate. The flex circuit may also provide a platform for implementation of other communication and maintenance functions.
申请公布号 US2009004480(A1) 申请公布日期 2009.01.01
申请号 US20070770263 申请日期 2007.06.28
申请人 DUFRESNE RALPH E;LE QUYNHGIAO N;FEIDER DAVID F 发明人 DUFRESNE RALPH E.;LE QUYNHGIAO N.;FEIDER DAVID F.
分类号 B32B15/08 主分类号 B32B15/08
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