发明名称 |
COMPOSITES WITH INTEGRATED MULTI-FUNCTIONAL CIRCUITS |
摘要 |
An exemplary embodiment provides a composite substrate including a resin matrix that has embedded therein a flex circuit and reinforcing filler. The flex circuit includes a metallic circuit on a film that is co-cured with the resin matrix. The metallic circuit may be configured for any of a variety of functions, including for example, dissipating energy generated by a lightning strike on the composite substrate. The flex circuit may also provide a platform for implementation of other communication and maintenance functions.
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申请公布号 |
US2009004480(A1) |
申请公布日期 |
2009.01.01 |
申请号 |
US20070770263 |
申请日期 |
2007.06.28 |
申请人 |
DUFRESNE RALPH E;LE QUYNHGIAO N;FEIDER DAVID F |
发明人 |
DUFRESNE RALPH E.;LE QUYNHGIAO N.;FEIDER DAVID F. |
分类号 |
B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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