| 摘要 |
A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.
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