发明名称 |
Method of Creating Molds of Variable Solder Volumes for Flip Attach |
摘要 |
A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.
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申请公布号 |
US2009004840(A1) |
申请公布日期 |
2009.01.01 |
申请号 |
US20070769389 |
申请日期 |
2007.06.27 |
申请人 |
FARINELLI MATTHEW J;CORDES STEVEN;NIELSEN DONNA S;MCKNIGHT SAMUEL ROY;CHEY JAY S;GRUBER PETER A;ROSNER JOANNA |
发明人 |
FARINELLI MATTHEW J.;CORDES STEVEN;NIELSEN DONNA S.;MCKNIGHT SAMUEL ROY;CHEY JAY S.;GRUBER PETER A.;ROSNER JOANNA |
分类号 |
H01L21/441;H01B13/00 |
主分类号 |
H01L21/441 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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