| 摘要 |
A micromirror device includes a micromirror chip, an electrode substrate, and an intermediate spacer sandwiched between the micromirror chip and the electrode substrate and having substantially the same shape as that of the micromirror chip, the intermediate spacer inhibiting the mirror support portion from being deformed by the moving movable mirror portion. The micromirror chip, the electrode substrate, and the intermediate spacer are arranged and stacked in a thickness direction. The intermediate spacer has an opening located substantially in the center of the intermediate spacer and a plate-like fixed member having a plurality of through-holes disposed around the periphery of the opening. A junction member is melted by desired heating and weighting and inserted and placed in each of the through-holes. When melted, the junction member joins the micromirror chip to the electrode substrate.
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