| 摘要 |
In one aspect of the present invention, a manufacturing method of a semiconductor device may include performing an electrical test on a plurality of electronic components on a wafer, generating a mapping data set including category information representing categories of the respective electronic components based on the electrical test result and position information representing positions of the respective electronic components in the wafer, forming bumps on the plurality of electronic components at wafer level in various bump layouts employed in accordance with the categories assigned to the respective electronic components, with reference to the mapping data set, and dicing the wafer to separate the plurality of electronic components into individual chips, after forming the bumps. |
