| 摘要 |
Techniques for a land grid array (LGA) socket loaded mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and a LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.
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