| 摘要 |
In some embodiments, a multilayer preform for fast transient liquid phase bonding is presented. In this regard, a method is introduced consisting of forming a plurality of first alloy layers, forming a plurality of second alloy layers, wherein the second alloy has a melting temperature that is higher than the melting temperature of the first alloy, and placing the first and second alloy layers together in an alternating sequence such that there is one more layer of the first alloy than of the second alloy and that the top and bottom layers of the formation are of the first alloy. Other embodiments are also disclosed and claimed.
|
