| 摘要 |
The present invention provides an electronic module and fabrication method thereof in which the mounting area of an electronic component can be increased and connection failure between a ground electrode and metal shield can be suppressed to sufficiently ensure the connection strength between the ground electrode and conductive shield. In an electronic module 100, an electronic component 60 is mounted on a multi-layer substrate 1 incorporating a semiconductor device 30 and the like, and these are sealed by a sealing layer 110 of epoxy resin or the like, and further the sealing layer 110 and multi-layer substrate 1 are covered with a metal shield 120. The multi-layer substrate 1 and metal shield 120 are electrically connected via a ground electrode GN exposed as a result of cutting away a part of the multi-layer substrate 1. |
