| 发明名称 |
DIE SEAL RING AND WAFER HAVING THE SAME |
| 摘要 |
A die seal ring disposed in a die and surrounding an integrated circuit region of the die is described. The die seal ring has at least two different local widths. |
| 申请公布号 |
US2009001522(A1) |
申请公布日期 |
2009.01.01 |
| 申请号 |
US20070771122 |
申请日期 |
2007.06.29 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
WU PING-CHANG |
| 分类号 |
H01L29/02 |
主分类号 |
H01L29/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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