| 摘要 |
Processing assembly comprising a processing chamber (2) adapted for receiving at least one wafer (5) to be processed, the processing assembly (1) further being provided with a pump (3) being connectable in fluid connection with the processing chamber (2) for maintaining the pressure in the processing chamber (2) in a low pressure range during processing, wherein the processing assembly (1) is provided with a second pump (4) being connectable in fluid connection with the processing chamber (2) for lowering the pressure from a relatively high pressure, e.g. atmospheric pressure, to the low pressure range, wherein gas flow in the processing chamber (2) during lowering the pressure has a constant value. The invention further relates to a method for processing a wafer (5) in such a processing assembly (1).
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