| 发明名称 |
METHOD OF ATTACHING DIE TO CIRCUIT BOARD WITH AN INTERMEDIATE INTERPOSER |
| 摘要 |
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.
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| 申请公布号 |
US2009002963(A1) |
申请公布日期 |
2009.01.01 |
| 申请号 |
US20070768939 |
申请日期 |
2007.06.27 |
| 申请人 |
COONEY ROBERT C;WILKINSON JOSEPH M |
发明人 |
COONEY ROBERT C.;WILKINSON JOSEPH M. |
| 分类号 |
H05K7/10 |
主分类号 |
H05K7/10 |
| 代理机构 |
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代理人 |
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