发明名称 Semiconductor device and manufacturing method thereof
摘要 <p>A semiconductor device is provided with: a semiconductor substrate of a predetermined electroconduction type; a hetero semiconductor region contacted with a first main surface of the semiconductor substrate and comprising a semiconductor material having a bandgap different from that of the semiconductor substrate; a gate electrode formed through a gate insulator layer at a position adjacent to a junction region between the hetero semiconductor region and the semiconductor substrate; a source electrode connected to the hetero semiconductor region; and a drain electrode connected to the semiconductor substrate; wherein the hetero semiconductor region includes a contact portion contacted with the source electrode, at least a partial region of the contact portion is of the same electroconduction type as the electroconduction type of the semiconductor substrate, and the partial region has an impurity concentration higher than an impurity concentration of at least that partial region of a gate-electrode facing portion in the hetero semiconductor region which is positioned to face the gate electrode through the gate insulator layer. </p>
申请公布号 EP1850395(A3) 申请公布日期 2008.12.31
申请号 EP20070007924 申请日期 2007.04.18
申请人 NISSAN MOTOR CO., LTD. 发明人 HAYASHI, TETSUYA;HOSHI, MASAKATSU;SHIMOIDA, YOSHIO;TANAKA, HIDEAKI;YAMAGAMI, SHIGEHARU
分类号 H01L29/78;H01L21/04;H01L29/08;H01L29/10;H01L29/24;H01L29/267;H01L29/49 主分类号 H01L29/78
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