发明名称 MASK FOR SUPPRESSING WAFER DEFECTS, METHOD FOR MANUFACTURING THE SAME, AND EXPOSURE METHOD USING THE SAME
摘要 <p>A photo mask preventing wafer defects and manufacturing method thereof are provided to increase a manufacturing efficiency of a photo mask by preventing defects from transferring on a wafer. A photo mask preventing wafer defects includes a transparent substrate(110), mask patterns(121), edge patterns(127), and a backplane light-shielding layer pattern(200). The substrate includes a chip area of an inner side and a frame(102) part of a chip area outer block. The mask pattern is formed in the chip area of a substrate front surface. The edge pattern is formed on the frame part of the substrate front surface. The backplane light-shielding layer pattern is formed on a backplane of the substrate corresponding to the frame part.</p>
申请公布号 KR20080114419(A) 申请公布日期 2008.12.31
申请号 KR20070063949 申请日期 2007.06.27
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE, SANG IEE
分类号 H01L21/027 主分类号 H01L21/027
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