摘要 |
<p>A photo mask preventing wafer defects and manufacturing method thereof are provided to increase a manufacturing efficiency of a photo mask by preventing defects from transferring on a wafer. A photo mask preventing wafer defects includes a transparent substrate(110), mask patterns(121), edge patterns(127), and a backplane light-shielding layer pattern(200). The substrate includes a chip area of an inner side and a frame(102) part of a chip area outer block. The mask pattern is formed in the chip area of a substrate front surface. The edge pattern is formed on the frame part of the substrate front surface. The backplane light-shielding layer pattern is formed on a backplane of the substrate corresponding to the frame part.</p> |