SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, SEMICONDUCTOR ELEMENT MOUNTING METHOD AND PRESSURIZING TOOL

摘要

A semiconductor chip mounting structure is formed by making a bump, which is formed on a pad on a semiconductor chip, and a substrate whereupon a sheet-like sealing adhesive resin is attached on the surface face each other, pressing the bump and the substrate with a tool to fill a gap between the semiconductor chip and the substrate with the sealing adhesive resin, and connecting the pad of the semiconductor chip and an electrode of the substrate through a bump. The entire side surface at the corner portion of the semiconductor chip is covered with the sealing adhesive resin.Thus, thermal expansion and differential shrinkage of each member due to heating/cooling process for mounting, and load generated at the corner portion of the semiconductor chip due to warping of the substrate to mechanical load after mounting are reduced, and breakage inside the chip is eliminated.