发明名称 |
APPARATUS FOR GRIPPING OF WAFER |
摘要 |
<p>A water gripping apparatus is provided to prevent damage to the water due to drop of the wafer by preventing the separation of the gripped wafer by a pair of arms. A wafer gripping apparatus is composed of a gripper(10), a space control member, and a fixing block(30). The gripper includes a pair of arms(11) with a hook shape symmetrically in both sides and the gripper pivotally connects the arms in an opposite direction by the axis of rotation in the upper part. The space control member adjusts interval between both arms in the lower portion around the axis of rotation of the gripper. The fixing block covers the space control member from the outside while axis-supporting the axis of rotation. The fixing block is equipped to ascend and descend by a lifting block(340).</p> |
申请公布号 |
KR20080114155(A) |
申请公布日期 |
2008.12.31 |
申请号 |
KR20070063461 |
申请日期 |
2007.06.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN, MYUNG SOO |
分类号 |
H01L21/677;H01L21/67;H01L21/687 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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