| 摘要 |
A chamber apparatus for manufacturing semiconductor device including a chuck is provided to prevent defect on a substrate by preventing a foreign material from falling to the substrate according to a separation of a polymer layer. A chamber apparatus for manufacturing semiconductor device includes a processing chamber and a chuck. The processing chamber has a curved surface inducing a polymer adsorption in an wall(110) surface faced in an internal space in which a board processing process is performed. The chuck supports the substrate mounted within the chamber. The curved structure adheres a metal grid(111) in the wall surface.
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