发明名称 |
Surface electrode structure on ceramic multi-layer substrate and process for producing the same |
摘要 |
In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips 30 as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes, at least the lowermost layer is made of a sintered silver conductor 51 which is partly buried in the ceramic multi-layer substrate 40, a nickel or a nickel alloy layer 52 being contained as an intermediate layer, and the topmost layer being a gold layer 53. Thus, it is provided a surface electrode structure on a ceramic multi-layer substrate that is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability. <IMAGE> |
申请公布号 |
EP1191829(B1) |
申请公布日期 |
2008.12.31 |
申请号 |
EP20010122316 |
申请日期 |
2001.09.18 |
申请人 |
TDK CORPORATION |
发明人 |
UCHIKOBA, FUMIO;GOI, TOMOYUKI |
分类号 |
H05K3/24;H05K3/34;H01L23/13;H01L23/14;H01L23/498;H03H3/08;H03H9/25;H03H9/72;H05K3/46 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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