| 摘要 |
<p>An apparatus for transferring a semiconductor device and a transferring method using the same are provided to supply a frame without a defective part to a magazine by detecting the thickness of the frame which is the molded semiconductor device. An apparatus for transferring a semiconductor device transfers the molded semiconductor device from the resin mold part. The apparatus for transferring the semiconductor device includes a transfer unit(100), a pushing unit(200), a thickness measuring unit(300), and a discharging unit(400). The transfer unit guides the transfer of the molded semiconductor device. The pushing unit is installed in the pushing unit and transfers the molded semiconductor device. The thickness measuring unit senses the thickness of the molded semiconductor device which is transferred by the pushing unit. The discharging unit discharges the defective part of the molded semiconductor device.</p> |
