| 摘要 |
The method of forming bump of the semiconductor chip is provided to mass-produce the semiconductor chip to reduce the time required for the bump formation by forming the bump on the bonding pad by cutting the metal thin film along the edge of the bump pad. The method of making bump of the semiconductor chip comprises as follows. A step is for manufacturing the semiconductor chip in which bump pads are arranged in the upper side. A step is for adhering the metal film(120a) in the whole upper side of the semiconductor chip to cover the bump pad. A step is for forming the preliminary bump(120b) by adhering it to the bonding pad(110). A step is for removing the metal film which is adhered to the semiconductor chip to leave the preliminary bump on the bonding pad. A step is for forming the bump by connecting completely the preliminary bump on the bonding pad by heating the semiconductor chip having the preliminary bump.
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